C10700 Oxygen Free Copper with Silver (OFE) Material Properties
The following data is provided for informational purposes only. It was provided with permission by the Copper Development Association at www.copper.org.
Last Update: Feb 21, 2005
Chemical Compostion
(%max., unless shown as range or min.)
| CU (1X2) | O | AG | |
|---|---|---|---|
|
Min./Max. |
99.99 Min |
0.0010 |
0.085 |
|
Nominal |
– |
– |
– |
(1) Cu is determined by the difference between the impurity total and 100%.
(2) Cu value includes Ag.
(3) In troy ounce: Min = 25, Max = 0 and Nom = 0
Note: This is a high conductivity copper which has, in the annealed condition a minimum conductivity of 100% IACS except for Alloy C10100 which has a minimum conductivity of 101% IACS.
Applicable Specifications
| Product | Specification |
|---|---|
|
Shapes, Bus |
ASTM B187
MILITARY MIL-B-19231 |
Common Fabrication Process
Blanking, Coining, Coppersmithing, Drawing, Etching, Forming and Bending, Heading and Upsetting, Hot Forging and Pressing, Piercing and Punching, Roll Threading and Knurling, Shearing, Spinning, Squeezing and Swaging, Stamping
Fabrication Properties
| Joining Technique | Suitability |
|---|---|
|
Soldering |
Excellent |
|
Brazing |
Excellent |
|
Oxyacetylene Welding |
Fair |
|
Gas Shield Arc Welding |
Good |
|
Coated Metal Arc Welding |
Not Recommended |
|
Spot Weld |
Not Recommended |
|
Seam Weld |
Not Recommended |
|
Butt Weld |
Good |
|
Capacity for being Cold Worked |
Excellent |
|
Capacity for being Hot Formed |
Excellent |
|
Forgeability Rating |
65 |
|
Machineability Rating |
20 |
Physical Properties
| US Customary | Metric | |
|---|---|---|
|
Melting Point - Liquids |
1981 F |
1083 C |
|
Melting Point - Solidus |
1981 F |
1083 C |
|
Density |
0.323 LB/IN3 @ 68 F |
8.94 GM/CM3 @ 20 C |
|
Specific Gravity |
8.94 |
8.94 |
|
Electrical Resistivity |
10.3 OHMS–CMIL/FT @ 68 F |
1.73 MICROHM–CM @ 20 C
|
|
Electrical Conductivity * |
101% ACS @ 68 F |
0.585 MEGASIEMENS/CM @ 20 C |
|
Thermal Conductivity |
224.0 BTU · FT/(HR · FT2·OF) @ 68 F |
387.7 W/M · OK AT 20 C |
|
Coefficient of Thermal Expansion |
9.4 ·10–6 PER OF (68–212 F) |
16.9 ·10–6 PER OC (20–100 C)
|
|
Coefficient of Thermal Expansion |
9.6 ·10–6 PER OF (68–392 F) |
17.3 ·10–6 PER OC (20–200 C)
|
|
Coefficient of Thermal Expansion |
9.8 ·10–6 PER OF (68–572 F) |
17.6 ·10–6 PER OC (20–300 C)
|
|
Specific Heat Capacity |
0.092 BTU/LB/OF @ 68 F |
393.5 J/KG · OK AT 293 K |
|
Modulas of Elasticity in Tension |
17000 KSI |
117000 MPa |
|
Modulas of Rigidity |
6400 KSI |
44130 MPA |
*Volume and weight basis, minimum value.
Tempers Most Commonly Used
| Flat Products | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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|
Bar, Drawn |
H01, H04, H06, O60 |
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|
Bar, Rolled |
H01, H04, H06, M20, O60 |
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|
Plate |
H00, M20 |
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| Other | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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|
Shapes |
H04, M20, M30, O60 |
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Typical Uses
Automotive
Gaskets, Radiators
Electrical
Conductors, Transistor Bases, Commutator Segments, Busbars, Contacts, Windings, Switches, Printed Circuit Foil, Radio Parts, Conductivity Wire, Terminal Connectors