C10100 Oxygen Free Electronic Copper (OFE) Material Properies

The following data is provided for informational purposes only. It was provided with permission by the Copper Development Association at www.copper.org.

Last Update: Feb 21, 2005

Chemical Compostion

(%max., unless shown as range or min.)

CU (1) SB AS O P TE
Min./Max.
99.99 Min
0.0004
0.0005
0.0005
0.0003
0.0002
Nominal

Cu is determined by the difference between the impurity total and 100%. The Cu value is exclusive of Ag. Note: The following additional maximum limits shall apply: Bi, 1ppm (.0001%); Cd, 1ppm (.0001%); Fe, 10ppm (.0010%); Pb, 5ppm (.0005%); Mn, 0.5ppm (.00005%); Ni, 10ppm (.0010%); Se, 3ppm (.0003%); Ag, 25ppm(.0025%); S, 15ppm (.0015%); Sn, 2ppm (.0002%); Zn, 1ppm (.0001%).

Note: This is a high conductivity copper which has, in the annealed condition a minimum conductivity of 100% IACS except for Alloy C10100 which has a minimum conductivity of 101% IACS.

Applicable Specifications

Product Specification
Shapes
ASTM F68
Shapes, Bus
ASTM B187

Common Fabrication Process

Blanking, Coining, Coppersmithing, Drawing, Etching, Forming and Bending, Heading and Upsetting, Hot Forging and Pressing, Piercing and Punching, Roll Threading and Knurling, Shearing, Spinning, Squeezing and Swaging, Stamping

Fabrication Properties

Joining Technique Suitability
Soldering
Excellent
Brazing
Excellent
Oxyacetylene Welding
Fair
Gas Shield Arc Welding
Good
Coated Metal Arc Welding
Not Recommended
Spot Weld
Not Recommended
Seam Weld
Not Recommended
Butt Weld
Good
Capacity for being Cold Worked
Excellent
Capacity for being Hot Formed
Excellent
Forgeability Rating
65
Machineability Rating
20

Physical Properties

US Customary Metric
Melting Point - Liquids
1981 F
1083 C
Melting Point - Solidus
1981 F
1083 C
Density
0.323 LB/IN3 @ 68 F
8.94 GM/CM3 @ 20 C
Specific Gravity
8.94
8.94
Electrical Resistivity
10.3 OHMS–CMIL/FT @ 68 F
1.73 MICROHM–CM @ 20 C
Electrical Conductivity *
101% ACS @ 68 F
0.591 MEGASIEMENS/CM @ 20 C
Thermal Conductivity
226.0 BTU · FT/(HR · FT2·OF) @ 68 F
391.1 W/M · OK AT 20 C
Coefficient of Thermal Expansion
9.4 ·10–6 PER OF (68–212 F)
16.9 ·10–6 PER OC (20–100 C)
Coefficient of Thermal Expansion
9.6 ·10–6 PER OF (68–392 F)
17.3 ·10–6 PER OC (20–200 C)
Coefficient of Thermal Expansion
9.8 ·10–6 PER OF (68–572 F)
17.6 ·10–6 PER OC (20–300 C)
Specific Heat Capacity
0.092 BTU/LB/OF @ 68 F
393.5 J/KG · OK AT 293 K
Modulas of Elasticity in Tension
17000 KSI
117000 MPa
Modulas of Rigidity
6400 KSI
44130 MPA

*Volume and weight basis, minimum value.

Tempers Most Commonly Used

Flat Products
Bar, Drawn
H01, H04, H06, O60
Bar, Rolled
H01, H04, H06, M20, O60
Plate
H00, M20
Other
Shapes
H04, M20, M30, O60, OS050

Typical Uses

Automotive

Automotive Rectifiers

Electrical

Conductors, Glass–to–Metal Seals, High Resistance–Ratio Cryogenic Shunts, Bus Bars, Lead–in Wire, Vacuum Seals, Transistor Component Bases, Bus Conductors, Wave Guides, Hollow Conductors, Anodes for Vacuum Tubes, Coaxial Cable, Coaxial Tube, Klystrons, Microwave Tubes